Asanble SMT ki gen ladan asanble BGA | |
Aksepte SMD chips | 01005, BGA, QFP, QFN, TSOP |
Wotè eleman | 0.2-25mm |
Min anbalaj | 0201 |
Min distans ant BGA | 0.25-2.0mm |
Min gwosè BGA | 0.1-0.63mm |
Min espas QFP | 0.35mm |
Min gwosè asanble | (X * Y) 50 * 30mm |
Max gwosè asanble | (X * Y) 350 * 550mm |
Pick-plasman presizyon | ± 0.01mm |
Kapasite plasman | 0805, 0603, 0402, 0201 |
Segondè pin konte anfòm pou laprès disponib | |
Kapasite SMT pou chak jou | 2,000,000 pwen |
FOB Port | Shenzhen |
Kòd HTS | 8509.90.00 00 |
Tan plon | 15-30 jou |