Kouch | 1-2 Kouch |
Fini epesè | 16-134mil (0.4mm-3.4mm) |
Max. Dimansyon | 500mm * 1200mm |
Epesè Copper | 35um, 70um, 1 a 10oZ |
Min Lajè Liy / Espas | 4mil (0.1mm) |
Min fini twou gwosè | 0.95mm |
Min. Gwosè egzèsis | 1.00mm |
Max. Gwosè egzèsis | 6.5mm |
Tolerans gwosè twou fini | ± 0.050mm |
Ouverture Pozisyon Precision | ± 0.076mm |
Min SMT PAD Size | 0.4mm±0.1mm |
Min.Solder Mask PAD | 0.05mm (2mil) |
Min.Solder Mask kouvri | 0.05mm (2mil) |
Mask soude epesè | > 12um |
Fini andigman | HAL, HAL san plon, OSP, Immersion Gold, elatriye |
HAL epesè | 5-12um |
Immersion Gold Epesè | 1-3mil |
Epesè fim OSP | ENTEK PLUS HT:0.3-0.5um; F2: 0.15-0.3um |
Deskripsyon Fini | Wout & pwensonaj; Devyasyon presizyon ± 0.10mm |
Kondiktivite tèmik | 1.0 a 12w/mk |
FOB Port | Shenzhen |
Ekspòtasyon Carton Dimansyon L/W/H | 36 x 26 x 25 santimèt |
Tan plon | 3-7 jou |
Inite pou chak katon ekspòtasyon | 5.0 |
Pwa Carton ekspòtasyon | 18 Kilogram |